LED package, method for manufacturing LED package, and packing member for LED package

ABSTRACT

According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromthe prior Japanese Patent Application No. 2010-19780, filed on Jan. 29,2010; the entire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to an LED (Light EmittingDiode) package, a method for manufacturing an LED package and a packingmember for an LED package.

BACKGROUND

Heretofore, an LED package in which an LED chip is mounted is preparedby mounting the LED chip on a lead frame and then sealing the lead frameand the LED chip with a resin material (for instance, refer to JP-A2004-274027 (Kokai)).

Such an LED package, however, has a problem that the LED package isdifficult to handle because of a resin material included therein.Specifically, since the resin material is exposed from most part of anouter surface of each LED package, LED packages may adhere to each otheror may adhere to another member due to the softness and tackiness of theresin materials. An example thereof is that inspection of LED packagesis made difficult when the LED packages adhere to each other aftermanufacturing and before conveyance to the inspection process. Anotherexample is that unpacking LED packages at a delivery destination is madedifficult when the LED packages adhere to a packing member duringdelivery.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating an LED package according to afirst embodiment;

FIG. 2A is a cross-sectional view illustrating the LED package accordingto the first embodiment, and FIG. 2B is a plan view illustrating a leadframe;

FIG. 3 is a flow chart illustrating a method for manufacturing the LEDpackage according to the first embodiment;

FIGS. 4A to 6B are process sectional views illustrating the method formanufacturing the LED package according to the first embodiment;

FIG. 7A is a plan view illustrating a lead frame sheet in the firstembodiment, and FIG. 7B is a partially enlarged plan view illustratingelement regions of the lead frame sheet;

FIG. 8 is a graph illustrating influence of the surface roughness of theupper surface of the transparent resin body on the adhesiveness, withthe horizontal axis indicating the surface roughness of the uppersurface, and the vertical axis indicating the incidence rate of theadhesion between LED packages;

FIGS. 9A and 9B are optical micrographs illustrating the upper surfaceof the transparent resin body in the LED package after manufacturing,FIG. 9A shows the upper surface having a surface roughness of 0.09 μmand FIG. 9B shows the upper surface having a surface roughness of 2.0μm;

FIGS. 10A to 10H are process sectional views illustrating a method forforming a lead frame sheet of a variation of the first embodiment;

FIG. 11 is a perspective view illustrating an LED package according to asecond embodiment;

FIG. 12 is a side view illustrating the LED package according to thesecond embodiment;

FIG. 13 is a perspective view illustrating an LED package according to athird embodiment;

FIG. 14 is a cross-sectional view illustrating the LED package accordingto the third embodiment;

FIG. 15 is a perspective view illustrating an LED package according to afourth embodiment;

FIG. 16 is a cross-sectional view illustrating the LED package accordingto the fourth embodiment;

FIG. 17 is a perspective view illustrating an LED package according to afifth embodiment;

FIG. 18 is a cross-sectional view illustrating the LED package accordingto the fifth embodiment;

FIG. 19 is a perspective view illustrating an LED package according to asixth embodiment;

FIG. 20 is a cross-sectional view illustrating the LED package accordingto the sixth embodiment;

FIG. 21 is a perspective view illustrating a packing member for an LEDpackage according to a seventh embodiment;

FIG. 22 is a plan view illustrating one recessed portion of the packingmember for the LED package according to the seventh embodiment;

FIG. 23 is a cross-sectional view illustrating one recessed portion ofthe packing member for the LED package according to the seventhembodiment;

FIG. 24 is a plan view illustrating a packing member for an LED packageaccording to an eighth embodiment;

FIG. 25 is a plan view illustrating a packing member for an LED packageaccording to a ninth embodiment;

FIG. 26 is a cross-sectional view illustrating the packing member forthe LED package according to the ninth embodiment; and

FIG. 27 is a cross-sectional view for illustrating a packing member foran LED package according to a tenth embodiment.

DETAILED DESCRIPTION

In general, according to one embodiment, an LED package includes firstand second lead frames, an LED chip and a resin body. The first andsecond lead frames are apart from each other. The LED chip is providedabove the first and second lead frames, and the LED chip has oneterminal connected to the first lead frame and another terminalconnected to the second lead frame. In addition, the resin body coversthe first and second lead frames and the LED chip, and has an uppersurface with a surface roughness of 0.15 μm or higher and a side surfacewith a surface roughness higher than the surface roughness of the uppersurface.

According to another embodiment, a method for manufacturing an LEDpackage is disclosed. The method includes selectively removing part of aconductive material from a conductive sheet made of the conductivematerial to form a lead frame sheet in which a plurality of elementregions are arranged in a matrix pattern, in which a base patternincluding first and second lead frames arranged apart from each other isformed in each of the element regions, and in which the conductivematerial remains in each dicing region between the element regions insuch a way as to connect the adjacent element regions to each other. Themethod includes mounting an LED chip on each of the element regions ofthe lead frame sheet, connecting one terminal of the LED chip to thefirst lead frame, and connecting another terminal of the LED chip to thesecond lead frame. The method includes forming a resin plate on the leadframe sheet to bury the LED chip into the resin plate, the resin platehaving an upper surface with a surface roughness of 0.15 μm or higher.In addition, the method includes removing, by dicing, portions of thelead frame sheet and the resin plate disposed in the dicing region tocut the lead frame sheet and the resin plate into pieces each includingthe first and second lead frames and a resin body. A surface roughnessof a surface processed by the dicing is increased higher than 0.15 μm bythe cutting.

According to still another embodiment, a packing member for an LEDpackage is disclosed. The LED package has first and second lead frames,an LED chip and a resin body. The first and second lead frames are apartfrom each other. The LED chip is provided above the first and secondlead frames and the LED chip has one terminal connected to the firstlead frame and another terminal connected to the second lead frame. Theresin body covers the first and second lead frames and the LED chip, andhas an upper surface with a surface roughness of 0.15 μm or higher and aside surface with a surface roughness higher than the surface roughnessof the upper surface. In the packing member, a recessed portion tolocate the LED package is formed. Unevenness is formed on at least aportion of a side surface of the recessed portion. The unevenness isgreater than unevenness formed on the side surface of the resin body.

Hereinafter, embodiments of the invention will be described withreference to the drawings.

First of all, a first embodiment will be described.

The first to sixth embodiments are embodiments of LED packages.

FIG. 1 is a perspective view illustrating the LED package according tothis embodiment.

FIG. 2A is a cross-sectional view illustrating the LED package accordingto this embodiment. FIG. 2B is a plan view illustrating lead frames.

As shown in FIGS. 1 to 2B, an LED package 1 according to this embodimentincludes a pair of lead frames 11 and 12. The lead frames 11 and 12 eachhave a planar shape, and are disposed on the same plane but apart fromeach other. The lead frames 11 and 12 may be formed of the sameconductive material. For example, each of the lead frames includes acopper plate and a silver plated layer formed on an upper surface and alower surface of the copper plate. Incidentally, no silver plated layeris formed on edge surfaces of the lead frames 11 and 12, and the copperplates are exposed therefrom.

Hereinafter, in this specification, for convenience of description, anXYZ rectangular coordinate system is introduced. Among directionsparallel to upper surfaces of the lead frames 11 and 12, a directionfrom the lead frame 11 to the lead frame is defined as a +X direction.Among directions perpendicular to the upper surfaces of the lead frames11 and 12, an upward direction, i.e., a direction in which an LED chip14 to be described later is mounted on the lead frames when seentherefrom, is defined as a +Z direction. One of directions whichintersect both the +X direction and the +Z direction is defined as a +Ydirection. Note that directions opposite to the +X direction, the +Ydirection, and the +Z direction are respectively defined as a −Xdirection, a −Y direction, and a −Z direction. Meanwhile, for example,the “+X direction” and the “−X direction” may be collectively referredto as simply an “X direction.”

The lead frame 11 includes a base portion 11a that is rectangular whenseen in a Z direction. From this base portion 11 a, four extendingportions 11 b, 11 c, 11 d, 11 e are extended. The extending portion 11 bextends in the +Y direction from a central portion, in the X direction,of an edge of the base portion 11 a, the edge being directed in the +Ydirection. The extending portion 11 c extends in the −Y direction from acentral portion, in the X direction, of an edge of the base portion 11a, the edge being directed in the −Y direction. The positions of theextending portion 11 b and 11 c correspond to each other in the Xdirection. The extending portions 11 d and 11 e extend in the −Xdirection respectively from end portions of an edge of the base portion11 a, the edge being directed in the −X direction. In this manner, eachof the extending portion 11 b to 11 e extends from a corresponding oneof three different sides of the base portion 11 a.

The length in the X direction of the lead frame 12 is shorter than thatof the lead frame 11, and the length in a Y direction are the samebetween the two. The lead frame 12 includes a base portion 12 a that isrectangular when seen in the Z direction. From this base portion 12 a,four extending portions 12 b, 12 c, 12 d, 12 e are extended. Theextending portion 12 b extends in the +Y direction from an end portionof the −X direction side, of an edge of the base portion 12 a, the edgebeing directed in the +Y direction. The extending portion 12 c extendsin the −Y direction from an end portion of the −X direction side, of anedge of the base portion 12 a, the edge being directed in the −Ydirection. The extending portions 12 d and 12 e extend in the +Xdirection respectively from end portions of an edge of the base portion12 a, the edge being directed in the +X direction. In this manner, eachof the extending portions 12 b to 12 e extends from a corresponding oneof three different sides of the base portion 12 a. The widths of theextending portions 11 d and 11 e of the lead frame 11 may be the same asor different from the widths of the extending portions 12 d and 12 e ofthe lead frame 12. However, in case that the widths of the extendingportions 11 d and 11 e are different from the widths of the extendingportions 12 d and 12 e, an anode and a cathode are easilydistinguishable from each other.

A projected portion 11 g is formed on a central portion, in the Xdirection, of the base portion 11 a at a lower surface 11 f of the leadframe 11. Accordingly, the lead frame 11 has two levels of thickness.The central portion, in the X direction, of the base portion 11 a, i.e.,a portion where the projected portion 11 g is formed, is relativelythick, while an edge portion, in the +X direction, of the base portion11 a as well as the extending portion 11 b to 11 e are relatively thin.FIG. 2B shows a thin plate portion 11 t that is a portion of the baseportion 11 a where the projected portion 11 g is not formed. Similarly,a projected portion 12 g is formed on a central portion, in the Xdirection, of the base portion 12 a at a lower surface 12 f of the leadframe 12. Accordingly, the lead frame 12 has two levels of thickness.The central portion, in the X direction, of the base portion 12 a isrelatively thick because the projected portion 12 g is formed, while anedge portion, in the −X direction, of the base portion 12 a as well asthe extending portions 12 b to 12 e are relatively thin. FIG. 2B shows athin plate portion 12 t that is a portion of the base portion 12 a wherethe projected portion 12 g is not formed. To put these differently,indentations are formed at lower surfaces of the edge portion, in the +Xdirection, of the base portion 11 a and the edge portion, in the −Xdirection, of the base portion 12 a. The indentations extend in the Ydirection along edges of the base portions 11 a and 12 a. In FIG. 2B,the relatively thin portions of the lead frames 11 and 12, i.e., thethin plate portions and the extending portions, are indicated by hatchwith broken lines.

The projected portions 11 g and 12 g are formed in regions of the leadframes 11 and 12, the regions being apart from the edges of the leadframes 11 and 12, the edges facing each other. Regions including theseedges are the thin plate portions 11 t and 12 t. An upper surface 11 hof the lead frame 11 and an upper surface 12 h of the lead frame 12 areon the same plane. A lower surface of the projected portion 11 g of thelead frame 11 and a lower surface of the projected portion 12 g of thelead frame 12 are on the same plane. The positions of upper surfaces ofthe extending portions in the Z direction coincide with the positions ofthe upper surfaces of the lead frames 11 and 12. Thus, the extendingportions are disposed on the same XY plane.

A die mounting material 13 is attached to a portion of a region of theupper surface 11 h of the lead frame 11, the region corresponding to thebase portion 11 a. In this embodiment, the die mounting material 13 maybe conductive or insulating. When the die mounting material 13 isconductive, the die mounting material 13 is formed of, for example, asilver paste, solder, eutectic solder, or the like. When the diemounting material 13 is insulating, the die mounting material 13 isformed of, for example, a transparent resin paste.

The LED chip 14 is provided on the die mounting material 13.Specifically, the die mounting material 13 fixes the LED chip 14 to thelead frame 11, and thereby the LED chip 14 is mounted on the lead frame11. The LED chip 14 has a substrate and a semiconductor layer stacked onthe substrate. The semiconductor layer is made of gallium nitride (GaN)or the like and the substrate is a sapphire substrate, for example. Theshape is, for example, a rectangular parallelepiped. Terminals 14 a and14 b are provided on an upper surface of the LED chip 14. The LED chip14 emits blue light, for example, when a voltage is supplied between theterminal 14 a and the terminal 14 b.

One end of a wire 15 is bonded to the terminal 14 a of the LED chip 14.The wire 15 is led out from the terminal 14 a in the +Z direction(immediately upward direction) and curved in a direction between the −Xdirection and the −Z direction. The other end of the wire 15 is bondedto the upper surface 11 h of the lead frame 11. Thereby, the terminal 14a is connected to the lead frame 11 through the wire 15. Meanwhile, oneend of a wire 16 is bonded to the terminal 14 b. The wire 16 is led outfrom the terminal 14 b in the +Z direction and curved in a directionbetween the +X direction and the −Z direction. The other end of the wire16 is bonded to the upper surface 12 h of the lead frame 12. Thereby,the terminal 14 b is connected to the lead frame 12 through the wire 16.The wires 15 and 16 are formed of a metal, for example, gold oraluminum.

The LED package 1 also includes a transparent resin body 17. Thetransparent resin body 17 is formed of a transparent resin, for example,a silicone resin. Herein, the term “transparent” includes meaning oftranslucent, also. The transparent resin body 17 has an appearance ofrectangular parallelepiped, and covers the lead frames 11 and 12, thedie mounting material 13, the LED chip 14, and the wires 15 and 16. Theappearance of the transparent resin body 17 is the appearance of the LEDpackage 1. A portion of the lead frame 11 and a portion of the leadframe 12 are exposed from a lower surface and side surfaces of thetransparent resin body 17.

More specifically, the lower surface of the projected portion 11 g,which is a part of the lower surface 11 f of the lead frame 11, isexposed from the lower surface of the transparent resin body 17. Tipedge surfaces of the extending portions 11 b to lie are exposed from theside surfaces of the transparent resin body 17. Meanwhile, the entireupper surface 11 h, a region of the lower surface 11 f other than theprojected portion 11 g, side surfaces of the projected portion 11 g, andedge surfaces of the base portion 11 a of the lead frame 11 are coveredwith the transparent resin body 17. Similarly, the lower surface of theprojected portion 12 g of the lead frame 12 is exposed from the lowersurface of the transparent resin body 17. Tip edge surfaces of theextending portions 12 b to 12 e are exposed from the side surfaces ofthe transparent resin body 17. The entire upper surface 12 h, a regionof the lower surface 12 f other than the projected portion 12 g, sidesurfaces of the projected portion 12 g, and edge surfaces of the baseportion 12 a are covered with the transparent resin body 17. In the LEDpackage 1, the lower surfaces of the projected portions 11 g and 12 g,exposed from the lower surface of the transparent resin body 17, serveas external electrode pads. As described above, the transparent resinbody 17 has a rectangular shape when seen from above, and the tip edgesurfaces of the aforementioned multiple extending portions of each ofthe lead frames 11 and 12 are exposed from a corresponding one of the isthree different side surfaces of the transparent resin body 17. Notethat in this specification, the term “cover” is a concept including botha case where one that covers is in contact with one that is covered anda case where the two are not in contact with each other.

Multiple phosphors 18 are dispersed in the transparent resin body 17.Each of the phosphors 18 is particulate, which absorbs light emittedfrom the LED chip 14 and emits light having a longer wavelength than theabsorbed light. For example, the phosphor 18 absorbs part of blue lightemitted from the LED chip 14 and emits yellow light. Thereby, blue lightemitted by the LED chip 14 but not absorbed by the phosphor 18 andyellow light emitted from the phosphor 18 are emitted from the LEDpackage 1. Hence, emission light from the LED package 1 becomes white asa whole. As such a phosphor 18, for example, YAG:Ce can be used.Incidentally, for convenience of illustration, in FIGS. 1, 2B and 3 aswell as the drawings subsequent to FIG. 3, no phosphor 18 isillustrated. Moreover, in FIG. 2A, the phosphors 18 are illustratedlarger and fewer than the actual ones.

As such phosphors 18, for example, a silicate-based phosphor which emitsyellow-green, yellow, or orange light can be used. The silicate-basedphosphor can be represented by the following general formula.(2−x−y)SrO.x(Ba_(u),Ca_(v))O.(1−a−b−c−d)SiO₂.aP₂O₅bAl₂O₃cB₂O₃dGeO₂:yEu²⁺

Here, 0<x, 0.005<y<0.5, x+y≦1.6, 0≦a, b, c, d<0.5, 0<u, 0<v, and u+v=1.

As the yellow phosphor, a YAG-based phosphor can also be used. TheYAG-based phosphor can be represented by the following general formula.(RE_(1-x)Sm_(x))₃(Al_(y)Ga_(1-y))₅O₁₂:Ce

Here, 0≦x<1, 0≦y≦1, and RE is at least one element selected from Y andGd.

As the phosphors 18, sialon-based red and green phosphors can also bemixed for use. Specifically, the phosphors can be a green phosphor whichabsorbs blue light emitted from the LED chip 14 and emits green light,and a red phosphor which absorbs blue light and emits red light.

The sialon-based red phosphor can be represented by the followinggeneral formula, for example.(M_(1-x),R_(x))_(a1)AlSi_(b1)O_(c1)N_(d1)

Here, M is at least one metal element except for Si and Al, and isparticularly desirably at least one of Ca and Sr. R is a luminescentcenter element, and is particularly desirably Eu. Additionally, x, a1,b1, c1, and d1 satisfy 0<x≦1, 0.6<a1<0.95, 2<b1<3.9, 0.25<c1<0.45, and4<d1<5.7.

A specific example of such a sialon-based red phosphor is representedbelow.Sr₂Si₇Al₇ON₁₃:Eu²⁺

The sialon-based green phosphor can be represented by the followinggeneral formula, for example.(M_(1-x),R_(x))_(a2)AlSi_(b2)O_(c2)N_(d2)

Here, M is at least one metal element except for Si and Al, and isparticularly desirably at least one of Ca and Sr. R is a luminescentcenter element, and is particularly desirably Eu. Additionally, x, a2,b2, c2, and d2 satisfy 0<x≦1, 0.93<a2<1.3, 4.0<b2<5.8, 0.6<c2<1, and6<d2<11.

A specific example of such a sialon-based green phosphor is representedbelow.Sr₃Si₁₃Al₃O₂N₂₁:Eu²⁺

Additionally, in this embodiment, an upper surface 17 a of thetransparent resin body 17 has a surface roughness (Ra) of 0.15 μm orhigher. As described later, unevenness of the upper surface 17 a of thetransparent resin body 17 is formed as a result of transferringunevenness from a release sheet that is used when the transparent resinis molded. Thus, if the surface roughness of the release sheet is 0.15μm or higher, the surface roughness of the upper surface 17 a of thetransparent resin body 17 can be 0.15 μm or higher. Note that, since theside surfaces of the transparent resin body 17 are surfaces processed bydicing, the surface roughnesses of the side surfaces are greater thanthe surface roughness of the upper surface thereof.

Next, a method for manufacturing the LED package according to thisembodiment will be described.

FIG. 3 is a flowchart illustrating the method for manufacturing the LEDpackage according to this embodiment.

FIGS. 4A to 6B are process sectional views illustrating the method formanufacturing the LED package according to this embodiment.

FIG. 7A is a plan view illustrating a lead frame sheet in thisembodiment. FIG. 7B is a partially enlarged plan view illustratingelement regions of the lead frame sheet.

First, as shown in FIG. 4A, a conductive sheet 21 made of a conductivematerial is prepared. The conductive sheet 21 includes, for example, astrip-shaped copper plate 21 a and silver plated layers 21 b formed onupper and lower surfaces of the copper plate 21 a. Next, masks 22 a and22 b are formed respectively on the upper and lower surfaces of theconductive sheet 21. Openings 22 c are selectively formed in the masks22 a and 22 b. The masks 22 a and 22 b can be formed by a printingmethod, for example.

Next, the conductive sheet 21 to which the masks 22 a and 22 b areattached is immersed in an etchant, and the conductive sheet 21 iswet-etched. Thereby, portions, of the conductive sheet 21, locatinginside the openings 22 c are selectively removed by etching. In thisevent, for example, by adjusting the immersion time, the etching amountis controlled, so that the etching is stopped before the conductivesheet 21 is penetrated by sole etching from either the upper surfaceside or the lower surface side of the conductive sheet 21. In thismanner, half-etching is performed from the upper and lower surfacesides. However, portions, of the conductive sheet 21, etched from boththe upper surface side and the lower surface side are penetrated. Afterthat, the masks 22 a and 22 b are removed.

Thus, as shown in FIGS. 3 and 4B, the copper plate 21 a and the silverplated layers 21 b are selectively removed from the conductive sheet 21,and a lead frame sheet 23 is formed. Incidentally, for convenience ofillustration, in FIG. 4B and the subsequent drawings, the copper plate21 a and the silver plated layer 21 b are not distinguished from eachother, and integrally illustrated as the lead frame sheet 23. Forexample, three blocks B are set in the lead frame sheet 23 as shown inFIG. 7A. In each of the blocks B, for example, approximately 1000element regions P are set. As shown in FIG. 7B, the element regions Pare arranged in a matrix pattern, and a dicing region D is formed in alattice pattern among the element regions P. In each of the elementregions P, a basic pattern including lead frames 11 and 12 which areapart from each other is formed. The metal material forming theconductive sheet 21 is left remained in the dicing region D in such away as to connect the adjacent element regions P to each other.

Specifically, although the lead frame 11 and the lead frame 12 are apartfrom each other in the element region P, a lead frame 11 belonging to acertain element region P is connected to a lead frame 12 belonging to anelement region P adjacent to the certain element region P in the −Xdirection when seen therefrom. Between the two frames, a projectedopening 23 a directed in the +X direction is formed. Moreover, leadframes 11 respectively belonging to element regions P adjacent to eachother in the Y direction are connected through a bridge 23 b. Similarly,lead frames 12 respectively belonging to element regions P adjacent toeach other in the Y direction are connected through a bridge 23 c. Thus,four conductive members extend in three directions from each of baseportions 11 a and 12 a of the lead frames 11 and 12. Furthermore, byperforming half-etching when the lead frame sheet 23 is etched from alower surface side thereof, projected portions 11 g and 12 g are formedrespectively on lower surfaces of the lead frames 11 and 12 (see FIGS.2A and 2B).

Next, as shown in FIGS. 3 and 4C, a reinforcement tape 24 made of, forexample, a polyimide is pasted on the lower surface of the lead framesheet 23. Then, a die mounting material 13 is attached onto each of thelead frames 11 belonging to the element regions P of the lead framesheet 23. For example, a pasty die mounting material 13 is ejected ontothe lead frame 11 from an ejector, or transferred onto the lead frame 11in a mechanical way. Next, an LED chip 14 is mounted on the die mountingmaterial 13. Next, a thermal treatment for sintering the die mountingmaterial 13 is performed (mount cure). Thus, in each of the elementregions P of the lead frame sheet 23, the LED chip 14 is mounted abovethe lead frame 11 with the die mounting material 13 interposedtherebetween.

Next, as shown in FIGS. 3 and 4D, by ultrasonic bonding, for example,one end of a wire 15 is bonded to a terminal 14 a of the LED chip 14,and the other end of the wire 15 is bonded to an upper surface 11 h ofthe lead frame 11. Moreover, one end of a wire 16 is bonded to aterminal 14 b of the LED chip 14, and the other end of the wire 16 isbonded to an upper surface 12 h of the lead frame 12. Thus, the terminal14 a is connected to the lead frame 11 through the wire 15, and theterminal 14 b is connected to the lead frame 12 through the wire 16.

Next, as shown in FIGS. 3 and 5A, a lower mold 101 is prepared. Thelower mold 101 and an upper mold 102 described below form a set ofmolds. In an upper surface of the lower mold 101, a rectangularparallelepiped-shaped recessed portion 101 a is formed. Meanwhile, atransparent resin material such as a silicone resin is mixed withphosphors 18 (see FIG. 2A) and stirred to prepare a liquid orsemi-liquid phosphor-containing resin material 26. The release sheet 105is disposed on an inner surface of the recessed portion 101 a of thelower mold 101, specifically, on a bottom surface and a side surface.The surface roughness of the release sheet 105 is taken to be 0.15 μm orhigher. Next, the phosphor-containing resin material 26 is supplied intothe recessed portion 101 a of the lower mold 101 with a dispenser 103.

Next, as shown in FIGS. 3 and 5B, the aforementioned lead frame sheet 23on which the LED chips 14 are mounted is attached on a lower surface ofthe upper mold 102 in a way that the LED chips 14 face downward. Then,the upper mold 102 is pressed against the lower mold 101, and the moldsare clamped. Thereby, the lead frame sheet 23 is pressed against thephosphor-containing resin material 26. In this event, thephosphor-containing resin material 26 covers the LED chips 14, the wires15 and 16, and enters portions, of the lead frame sheet 23, removed bythe etching. In this manner, the phosphor-containing resin material 26is molded. It is preferable that the mold process is performed in avacuum atmosphere. This prevents bubbles generated in thephosphor-containing resin material 26 from adhering to portionshalf-etched in the lead frame sheet 23.

Next, as shown in FIGS. 3 and 5C, with an upper surface of the leadframe sheet 23 being pressed against the phosphor-containing resinmaterial 26, a thermal treatment (mold cure) is performed to cure thephosphor-containing resin material 26. Then, the upper mold 102 isseparated from the lower mold 101 as shown in FIG. 6A. Thus, atransparent resin plate 29 is formed on the lead frame sheet 23. Thetransparent resin plate 29 covers the entire upper surface and a portionof the lower surface of the lead frame sheet 23, and the LED chips 14and so forth are buried therein. In this event, unevenness of thesurface of the release sheet 105 is transferred onto a surface and thesurface roughness is 0.15 μm or higher. In the transparent resin plate29, the phosphors 18 (See FIG. 2A) are dispersed. Subsequently, thereinforcement tape 24 is peeled from the lead frame sheet 23. Thereby,the lower surfaces of the projected portions 11 g and 12 g of the leadframes 11 and 12 (See FIGS. 2A and 2B) are exposed from the surface ofthe transparent resin plate 29.

Next, as shown in FIGS. 3 and 6B, with a blade 104, an assembly of thelead frame sheet 23 and the transparent resin plate 29 is diced from aside of the lead frame sheet 23. Specifically, the dicing is performedfrom the −Z direction side toward the +Z direction. Thereby, portions,of the lead frame sheet 23 and the transparent resin plate 29, disposedin the dicing region D are removed. As a result, portions, of the leadframe sheet 23 and the transparent resin plate 29, disposed in theelement regions P are segmented, and thus LED packages 1 shown in FIGS.1 to 2B are manufactured. Incidentally, the assembly of the lead framesheet 23 and the transparent resin plate 29 may be diced from a side ofthe transparent resin body 29.

In each of the LED packages 1 after dicing, the lead frames 11 and 12are separated from the lead frame sheet 23. Moreover, the transparentresin plate 29 is parted to form transparent resin bodies 17. The uppersurface 17 a of the transparent resin body 17 has a surface roughness of0.15 μm or higher. Furthermore, portions, of the dicing region D,extending in the Y direction pass through the openings 23 a of the leadframe sheet 23, and extending portions 11 d, 11 e, 12 d, 12 e are formedin the lead frames 11 and 12. In addition, the bridges 23 b are parted,and extending portions 11 b and 11 c are formed in the lead frame 11.The bridges 23 c are parted, and extending portions 12 b and 12 c areformed in the lead frame 12. Tip edge surfaces of the extending portions11 b to 11 e and 12 b to 12 e are exposed from side surfaces of thetransparent resin body 17

Next, as shown in FIG. 3, the LED package 1 is conveyed from a dicingapparatus to a test apparatus and the various tests are performed. Inthis event, tip edge surfaces of the extending portions 11 b to 11 e and12 b to 12 e can be used as test terminals.

Next, effects and advantages of this embodiment will be described.

In the LED package 1 according to this embodiment, the upper surface 17a of the transparent resin body 17, which forms the upper surface of theLED package, has a surface roughness of 0.15 μm or higher. For thisreason, the LED package 1 is less likely to be attached to another LEDpackage 1. This is presumably because of the increased surface roughnessof the transparent resin body 17. The increased surface roughness makesit less likely that a vacuum gap is formed between the transparent resinbody 17 and another transparent resin body 17 that comes into contacttherewith. Consequently, the two are less likely to be attached to eachother. Hence, the LED package 1 is easily handled, also. For example,since the LED packages 1 are less likely to adhere to each other afterthe aforementioned dicing process, the subsequent test is easilyperformed. Moreover, the LED package 1 is less likely to be attachedalso to another member; accordingly, the LED package 1 is easily handledafter the test, as well. For example, the LED package 1 is less likelyto adhere also to a packing member for holding the LED package 1 duringdelivery; accordingly, the unpacking operation and the mountingoperation are easily performed at the delivery destination, as well.

Not that, since the side surfaces of the transparent resin body 17,which form the side surfaces of the LED package, are surfaces processedby dicing, the surface roughnesses thereof are originally higher thanthe surface roughness of the upper surface 17 a. This makes adhesion tothe side surfaces less likely. Moreover, the metallic lead frames 11 and12 are exposed from the lower surface of the transparent resin body 17,which forms the lower surface of the LED package. This would makeadhesion to the lower surface less likely, also. Thus, when the uppersurface 17 a of the transparent resin body 17 has a surface roughness of0.15 μm or higher, the adhesiveness of the LED package 1 issignificantly reduced, and the handling characteristics are greatlyimproved.

Hereinafter, the effects will be described based on specific data.

FIG. 8 is a graph illustrating influence of the surface roughness of theupper surface of the transparent resin body on the adhesiveness, withthe horizontal axis indicating the surface roughness of the uppersurface, and the vertical axis indicating the incidence rate of theadhesion between LED packages.

FIGS. 9A and 9B are optical micrographs illustrating the upper surfaceof the transparent resin body in the LED package after manufacturing.FIG. 9A shows the upper surface having a surface roughness of 0.09 μm.FIG. 9B shows the upper surface having a surface roughness of 2.0 μm.

LED packages 1 were manufactured according to the aforementioned methodusing multiple kinds of the release sheets 105 that had differentsurface roughnesses from each other. In this event, several thousands ofthe LED packages 1 were manufactured from one lead frame sheet 33 asmentioned above. Then, whether the LED packages 1 adhered to each otherafter dicing was observed, and the incident rate was measured. Forexample, when two LED packages 1 adhere to each other among 100 LEDpackages 1, the incident rate was calculated to be 2%. This incidentrate was plotted on the vertical axis of FIG. 8. Moreover, the surfaceroughness of the upper surface of the LED package 1 after manufacturingwas measured. This measurement result was plotted on the horizontal axisof FIG. 8. Note that, in measuring the surface roughness, when thesurface roughness varies depending on the position of the upper surface17 a, the surface roughness is measured at multiple positions of theupper surface 17 a, and the average value is adopted. Meanwhile, whenthe surface roughness varies depending on the measurement direction, thesurface roughness is measured along two directions intersecting eachother, and the average value is adopted.

As shown in FIG. 8, the greater the surface roughness of the uppersurface of the LED package 1, i.e., the upper surface 17 a of thetransparent resin body 17, the lower the incident rate of the adhesion.Moreover, when the upper surface has a surface roughness of 0.15 μm orhigher, no adhesion occurred. As shown in FIG. 9A, the upper surfacehaving a surface roughness of 0.09 μm was smooth. In contrast, as shownin FIG. 9B, the upper surface having a surface roughness of 2.0 μm waslike a pearskin finish.

Additionally, in this embodiment, since the surface roughness of theupper surface 17 a of the transparent resin body 17 is high, the totalreflection of light emitted from the LED chip 14 at the upper surface 17a is suppressed. Thus, the light extraction efficiency is improved. Thiseffect is particularly noticeable when an LED package includes nophosphor 18 dispersed in the transparent resin body 17 and emitssingle-color light.

Next, effects and advantages other than the above of this embodimentwill be described.

In the LED package 1 according to this embodiment, no enclosure made ofa white resin is provided. Accordingly, no enclosure is degraded byabsorbing light and heat generated from the LED chip 14. Particularly,when an enclosure is formed of a thermoplastic polyamide resin, theresin is likely to be degraded. In this embodiment, however, there is noproblem of such degradation. For this reason, the LED package 1according to this embodiment has a high durability. Thus, the LEDpackage 1 according to this embodiment has a long life and a highreliability, and is applicable in wide usage.

Furthermore, in the LED package 1 according to this embodiment, noenclosure for covering a side surface of the transparent resin body 17is provided. Accordingly, light is emitted at a wide angle. For thisreason, the LED package 1 according to this embodiment is advantageouslyused when light needs to be emitted at a wide angle, for example, usedfor illumination and as a backlight of a liquid crystal television.

Still furthermore, in the LED package 1 according to this embodiment,the transparent resin body 17 covers portions of the lower surfaces andlarge portions of the edge surfaces of the lead frames 11 and 12, andholds peripheral portions of the lead frames 11 and 12. In this manner,the lower surfaces of the projected portions 11 g and 12 g of the leadframes 11 and 12 are exposed from the transparent resin body 17, andexternal electrode pads are formed; moreover, the holdability for thelead frames 11 and 12 is increased. Specifically, by forming theprojected portions 11 g and 12 g on the central portions, in the Xdirection, of the base portions 11 a and 12 a, indentations are formedat two edge portions, in the X direction, of each lower surface of thebase portions 11 a and 12 a. The transparent resin body 17 goes aroundand into the indentations to strongly hold the lead frames 11 and 12.This makes the lead frames 11 and 12 hardly detached from thetransparent resin body 17 in dicing, and the yield of the LED package 1is improved. Moreover, this can prevent that lead frames 11 and 12detach from the transparent resin body 17 by temperature stress in usingthe LED package 1.

Still furthermore, in the LED package 1 according to this embodiment,the silver plated layers are formed on the upper and lower surfaces ofthe lead frames 11 and 12. Since silver plated layers have a high lightreflectivity, the LED package 1 according to this embodiment has a highlight extraction efficiency.

Still furthermore, in this embodiment, from the single conductive sheet21, a large number, for example, approximately several thousands, of theLED packages 1 can be manufactured at once. Thus, the manufacturing costper LED package is reduced. In addition, since no enclosure is provided,the numbers of components and processes are small, and the cost is low.

Still furthermore, in this embodiment, the lead frame sheet 23 is formedby wet-etching. For this reason, when an LED package of novel layout ismanufactured, only the original plates of the masks need to be prepared.The initial cost is suppressed to a lower extent than a case where alead frame sheet 23 is formed by a method such as pressing with a mold.

Still furthermore, in the LED package 1 according to this embodiment,the extending portions are extended from the base portions 11 a and 12 aof the lead frames 11 and 12. Thus, the base portions themselves areprevented from being exposed from the side surfaces of the transparentresin body 17, and the exposed areas of the lead frames 11 and 12 arereduced. Moreover, the contact area between lead frames 11 and 12 andthe transparent resin body 17 can be made to increase. As a result, thelead frames 11 and 12 are prevented from being detached from thetransparent resin body 17. Moreover, corrosion of the lead frames 11 and12 is also suppressed.

The effects will be considered from the viewpoint of the manufacturingmethod. The openings 23 a and the bridges 23 b and 23 c are provided inthe lead frame sheet 23 in a way that the openings 23 a and the bridges23 b and 23 c exist within the dicing region D as shown in FIG. 7B.Thereby, the amount of metal portion within the dicing region D isreduced. Thus, dicing is performed easily, and wearing of the dicingblade is suppressed. Moreover, in this embodiment, from each of the leadframes 11 and 12, four extending portions are extended in threedirections. Thus, in the process of mounting the LED chip 14 shown inFIG. 4C, a lead frame 11 is surely supported in three directions by leadframes 11 and 12 in adjacent element regions P, and the mountability ishigh. Similarly, in the wire bonding process shown in FIG. 4D also,bonding positions of the wires are surely supported in the threedirections. Accordingly, the ultrasound applied in the ultrasonicbonding scarcely escapes, and the wires are favorably bonded to the leadframes and the LED chip.

Still furthermore, in the dicing process shown in FIG. 6B of thisembodiment, the dicing is performed from the lead frame sheet 23 side.Thereby, the metal material forming the end portions of the lead frames11 and 12 subjected to cutting stretches in the +Z direction on the sidesurface of the transparent resin body 17. For this reason, this metalmaterial never stretches in the −Z direction on the side surface of thetransparent resin body 17, nor protrudes from the lower surface of theLED package 1; hence, no burr is formed. Thus, when the LED package 1 ismounted, mounting failure due to a burr never happens.

Next, a variation of this embodiment will be described.

This variation is a variation of a method for forming a lead framesheet.

Specifically, in this variation, the method for forming a lead framesheet shown in FIG. 4A is different from that in the above-describedfirst embodiment.

FIGS. 10A to 10H are process sectional views illustrating the method forforming the lead frame sheet of this variation.

First, a copper plate 21 a is prepared as shown in FIG. 10A, andcleaned. Next, as shown in FIG. 10B, both surfaces of the copper plate21 a are coated with a resist and then dried to form resist films 111.Next, as shown in FIG. 10C, mask patterns 112 are disposed on the resistfilms 111, and subjected to exposure with ultraviolet irradiation.Thereby, exposed portions of the resist films 111 are cured, and resistmasks 111 a are formed. Next, as shown in FIG. 10D, development isperformed, and non-cured portions of the resist films 111 are washedaway. Thereby, the resist patterns 111 a are left remained on the upperand lower surfaces of the copper plate 21 a. Next, as shown in FIG. 10E,using the resist patterns 111 a as masks, etching is performed to removeexposed portions of the copper plate 21 a from both surfaces. In thisevent, the etching depth is approximately half the thickness of thecopper plate 21 a. Thereby, a region etched only from one surface sideis half-etched, while a region etched from both surface sides ispenetrated. Next, as shown in FIG. 10F, the resist patterns 111 a areremoved. Next, as shown in FIG. 10G, end portions of the copper plate 21a are covered with masks 113, and then plated. Thereby, silver platedlayers 21 b are formed on surfaces of portions, other than the endportions, of the copper plate 21. Next, as shown in FIG. 10H, theresultant is cleaned, and the masks 113 are removed. After that,inspection is performed. In this manner, a lead frame sheet 23 isformed. Configuration, manufacturing method, effects, and advantages,other than the above, of this variation are the same as those of theabove-described first embodiment.

Next, a second embodiment will be described.

FIG. 11 is a perspective view illustrating an LED package according tothis embodiment.

FIG. 12 is a side view illustrating the LED package according to thisembodiment.

As shown in FIGS. 11 and 12, a LED package 2 according to thisembodiment is different from the above-described LED package 1 accordingto the first embodiment (see FIG. 1) in that the lead frame 11 (seeFIG. 1) is divided in the X direction into two lead frames 31 and 32.The lead frame 32 is disposed between the lead frame 31 and the leadframe 12. Extending portions 31 d and 31 e corresponding to theextending portions 11 d and 11 e of the lead frame 11 (see FIG. 1) areformed on the lead frame 31. Extending portions 31 b and 31 c extendingrespectively in the +Y direction and the −Y direction are formed from abase portion 31 a. The positions of the extending portions 31 b and 31 ccorrespond to each other in the X direction. Furthermore, the wire 15 isbonded to the lead frame 31. Meanwhile, extending portions 32 b and 32 ccorresponding to the extending portions 11 b and 11 c of the lead frame11 (see FIG. 1) are formed on the lead frame 32. The LED chip 14 ismounted on the lead frame 32 with the die mounting material 13interposed therebetween. Moreover, projected portions corresponding tothe projected portion 11 g of the lead frame 11 are formed on the leadframes 31 and 32 in a divided manner as projected portions 31 g and 32g, respectively.

In this embodiment, the lead frames 31 and 12 function as externalelectrodes when a potential is applied from the outside. Meanwhile, nopotential needs to be applied to the lead frame 32. The lead frame 32can be used as a lead frame dedicated as a heat sink. Thus, whenmultiple LED packages 2 are mounted on one module, lead frames 32 can beconnected to a common heat sink. Incidentally, a ground potential may beapplied to the lead frame 32, or the lead frame 32 may be in the stateof floating. Moreover, when the LED package 2 is mounted on amotherboard, a so-called Manhattan phenomenon can be suppressed bybonding solder balls to each of the lead frame 31, 32 and 12. TheManhattan phenomenon refers to a phenomenon that when a device or thelike is mounted on a board with multiple solder balls or the likeinterposed therebetween, the device stands up due to different meltingtiming of the solder balls in a reflow furnace and the surface tensionof the solder. This phenomenon causes mounting failure. In thisembodiment, the lead frame layout is symmetrical with respect to the Xdirection, and the solder balls are densely disposed in the X direction;thereby, the Manhattan phenomenon is less likely to occur.

Moreover, in this embodiment, the lead frame 31 is supported by theextending portions 31 b to 31 e in three directions. Accordingly, thewire 15 is favorably bonded. Similarly, since the lead frame 12 issupported by the extending portions 12 b to 12 e in three directions,the wire 16 is favorably bonded.

Such an LED package 2 can be manufactured by a similar method to that inthe above-described first embodiment, if the basic pattern of theelement regions P of the lead frame sheet 23 is altered in theabove-described process shown in FIG. 4A. Specifically, LED packages ofvarious layouts can be manufactured only by altering the patterns of themasks 22 a and 22 b according to the manufacturing method described inthe above-described first embodiment. Configuration, manufacturingmethod, effects, and advantages, other than the above, of thisembodiment are the same as those of the above-described firstembodiment.

Next, a third embodiment will be described.

FIG. 13 is a perspective view illustrating an LED package according tothis embodiment.

FIG. 14 is a cross-sectional view illustrating the LED package accordingto this embodiment.

As shown in FIGS. 13 and 14, an LED package 3 according to thisembodiment includes a Zener diode chip 36 and so forth in addition tothe configuration of the LED package (see FIG. 1) according to theabove-described first embodiment. The Zener diode chip 36 is connectedbetween the lead frame 11 and the lead frame 12. Specifically, a diemounting material 37 made of a conductive material such as a silverpaste or solder is attached onto an upper surface of the lead frame 12,and the Zener diode chip 36 is provided on the die mounting material 37.Thus, the Zener diode chip 36 is mounted on the lead frame 12 with thedie mounting material interposed therebetween, and a lower surfaceterminal (unillustrated) of the Zener diode chip 36 is connected to thelead frame 12 with the die mounting material 37. Moreover, an uppersurface terminal 36 a of the Zener diode chip 36 is connected to thelead frame 11 through a wire 38. Specifically, one end of the wire 38 isconnected to the upper surface terminal 36 a of the Zener diode chip 36,and the wire 38 is led out from the upper surface terminal 36 a in the+Z direction and curved in a direction between the −Z direction and the−X direction. The other end of the wire 38 is bonded to an upper surfaceof the lead frame 11.

Thus, in this embodiment, the Zener diode chip 36 is connected inparallel to the LED chip 14. As a result, the durability forelectrostatic discharge (ESD) is improved. Configuration, manufacturingmethod, effects, and advantages, other than the above, of thisembodiment are the same as those of the above-described firstembodiment.

Next, a fourth embodiment will be described.

FIG. 15 is a perspective view illustrating an LED package according tothis embodiment.

FIG. 16 is a cross-sectional view illustrating the LED package accordingto this embodiment.

As shown in FIGS. 15 and 16, an LED package 4 according to thisembodiment is different from the above-described LED package 3 (see FIG.13) according to the third embodiment in that the Zener diode chip 36 ismounted on the lead frame 11. In this case, the lower surface terminalof the Zener diode chip 36 is connected to the lead frame 11 with thedie mounting material 37 interposed therebetween, and the upper surfaceterminal is connected to the lead frame 12 through the wire 38.Configuration, manufacturing method, effects, and advantages, other thanthe above, of this embodiment are the same as those of theabove-described third embodiment.

Next, a fifth embodiment will be described.

FIG. 17 is a perspective view illustrating an LED package according tothis embodiment.

FIG. 18 is a cross-sectional view illustrating the LED package accordingto this embodiment.

As shown in FIGS. 17 and 18, an LED package 5 according to thisembodiment is different from the above-described LED package 1 (seeFIG. 1) according to the first embodiment in that an LED chip 41 ofvertical conduction type is provided instead of the LED chip 14 of uppersurface terminal type. Specifically, in the LED package 5 according tothis embodiment, a die mounting material 42 made of a conductivematerial such as a silver paste or solder is formed on an upper surfaceof the lead frame 11. The LED chip 41 is mounted on the lead frame 11with the die mounting material 42 interposed therebetween. A lowersurface terminal (unillustrated) of the LED chip 41 is connected to thelead frame 11 through the die mounting material 42. Meanwhile, an uppersurface terminal 41 a of the LED chip 41 is connected to the lead frame12 through a wire 43.

In this embodiment, the LED chip 41 of vertical conduction type isadopted, and the number of wires is one. This surely prevents contactingof wires, and simplifies the wire bonding process. Configuration,manufacturing method, effects, and advantages, other than the above, ofthis embodiment are the same as those of the above-described firstembodiment.

Next, a sixth embodiment will be described.

FIG. 19 is a perspective view illustrating an LED package according tothis embodiment.

FIG. 20 is a cross-sectional view illustrating the LED package accordingto this embodiment.

As shown in FIGS. 19 and 20, an LED package 6 according to thisembodiment is different from the above-described LED package 1 (seeFIG. 1) according to the first embodiment in that an LED chip 46 of fliptype is provided instead of the LED chip 14 of upper surface terminaltype. Specifically, in the LED package 6 according to this embodiment,two terminals are provided on a lower surface of the LED chip 46.Moreover, the LED chip 46 is disposed like a bridge so as to straddlethe lead frame 11 and the lead frame 12. One of the lower surfaceterminals of the LED chip 46 is connected to the lead frame 11, and theother lower surface terminal is connected to the lead frame 12.

In this embodiment, the LED chip 46 of flip type is adopted and no wireis used. This increases the light extraction efficiency in the upwarddirection, and helps to omit 3o the wire bonding process. Moreover,rupturing of a wire due to thermal stress of the transparent resin body17 is also prevented. Configuration, manufacturing method, effects, andadvantages, other than the above, of this embodiment are the same asthose of the above-described first embodiment.

The LED package according to the invention is not limited to theabove-described first to sixth embodiments. Each of the above-describedembodiments can be implemented in combination with the otherembodiments. Moreover, those obtained through design alteration,addition, or deletion of the components, or those obtained throughcondition alteration, addition, or omission of the processes, which willbe made appropriately on the above-described first to sixth embodimentsby those skilled in the art are included in the scope of the invention,as long as such variations include the gist of the invention.

For example, in the above-described first embodiment, an example hasbeen shown that the surface roughness of the upper surface 17 a iscontrolled in a manner of transferring the unevenness of the surface ofthe release sheet 105 onto the upper surface 17 a of the transparentresin body 17. However, the invention is not limited thereto. Any methodmay be adopted to roughen the surface of the upper surface 17 a. Forexample, the upper surface 17 a may be roughened by performing liquidhoning on the LED package 1 after dicing. Alternatively, thephosphor-containing resin material 26 may be supplied on the releasesheet having a smooth surface, the release sheet being disposed on thebottom surface of the recessed portion 101 a of the lower mold 101, thebottom surface having a surface roughness of 0.15 μm or higher. In thismanner also, the upper surface 17 a can be roughened.

For example, in the above-described first embodiment, an example hasbeen shown that the lead frame sheet 23 is formed by wet-etching.However, the invention is not limited thereto. For example, the leadframe sheet 23 may be formed in a mechanical way such as pressing.Moreover, in the above-described first to sixth embodiments, exampleshave been shown that one LED chip is mounted on one LED package.However, the invention is not limited thereto. Multiple LED chips may bemounted on one LED package. Furthermore, a groove may be formed on theupper surface of the lead frame between a region where a die mountingmaterial is to be formed and a region where a wire is to be bonded.Alternatively, a recessed portion may be formed on the upper surface ofthe lead frame in a region where a die mounting material is to beformed. Thereby, even if the supply amount or supply position of the diemounting material varies, the die mounting material is prevented fromflowing out to the region where the wire is to be bonded, and the wirebonding is prevented from being inhibited.

Still furthermore, in the above-described first embodiment, an examplehas been shown that the lead frame is a copper plate and a silver platedlayer formed on the upper and lower surfaces of the copper plate.However, the invention is not limited thereto. For example, a rhodium(Rh) plated layer may be formed on at least one of silver plated layersrespectively formed on the upper and lower surfaces of a copper plate.Alternatively, a copper (Cu) plated layer may be formed between a copperplate and a silver plated layer. Furthermore, a gold-silver alloy (Au—Agalloy) plated layer may be formed on a nickel (Ni) plated layer formedon each of the upper and lower surfaces of a copper plate.

Still furthermore, in the above-described embodiments, examples havebeen shown that the LED chip is a chip which emits blue light, that thephosphor is a phosphor which absorbs blue color and emits yellow light,and that the color of light emitted from the LED package is white.However, the invention is not limited thereto. The LED chip may emitvisible light of any color other than blue, or may emit ultravioletlight or infrared radiation. The phosphor is not limited to the phosphorwhich emits yellow light. For example, the phosphor may emit blue light,green light, or red light. Moreover, the light emitted from the LED chipmay be emitted directly from the LED package without providing thephosphor.

Still furthermore, in the above-described embodiments, examples havebeen shown that the base portion of the lead frame has a rectangularshape when seen from above. However, the base portion may have a shapethat at least one corner thereof is cut off. Thereby, the corner of thelead frame with a right angle or an acute angle is not provided aroundcorners of the LED package. And the chamfered corner will not serve asthe origin of resin peeling and crack of the transparent resin body. Asa result, the incidences of resin peeling and crack are suppressed inthe LED package as a whole.

According to the above-described first to sixth embodiments, an LEDpackage easy to handle and a method for manufacturing the LED packageare provided.

Next, a seventh embodiment will be described.

The seventh embodiment to a tenth embodiment are embodiments of apacking member for an LED package.

FIG. 21 is a perspective view illustrating a packing member for an LEDpackage according to this embodiment.

FIG. 22 is a plan view illustrating one recessed portion of the packingmember for the LED package according to this embodiment.

FIG. 23 is a cross-sectional view illustrating the recessed portion ofthe packing member for the LED package according to this embodiment.

A packing member 201 for an LED package according to this embodiment isto locate an LED package as described in the above-described first tosixth embodiments. This embodiment shows an example of housing the LEDpackage 1 according to the above-described first embodiment. However,the LED package that can be located is not limited to ones shown in theabove-described first to sixth embodiments. For example, in the LEDpackage, an upper surface of the transparent resin body may have asurface roughness lower than 0.15 μm.

As shown in FIG. 21, the packing member 201 is, for example, a carriertape. The packing member 201 has a belt-like shape, and is normally usedwhile wound around a reel (unillustrated). Multiple recessed portions202 are formed in one surface of the packing member 201. The recessedportions 202 are arranged in one row along a direction in which thepacking member 201 extends. The packing member 201 is formed of, forexample, a resin material such as a polystyrene, polycarbonate,polyester, or vinyl chloride. Alternatively, the packing member 201 maybe formed of paper. Carbon (C) may be added in order to impartconductivity to the packing member 201.

As shown in FIGS. 22 and 23, the recessed portion 202 has asubstantially rectangular parallelepiped shape. The recessed portion 202is formed of one substantially rectangular bottom surface 202 a whenseen from above, and four side surfaces 202 b to 202 e. Two projectedportions 203 are formed at each of the side surfaces 202 b to 202 e. Theprojected portions 203 are arranged along a direction parallel to thesurface of the packing member 201. Thereby, unevenness is formed on eachof the side surfaces 202 b to 202 e. The unevenness is greater thanunevenness formed on a side surface of the LED package 1, i.e., a sidesurface of the transparent resin body 17.

Next, a method for using the packing member for an LED package accordingto this embodiment configured as mentioned above, i.e., a method forconveying an LED package according to this embodiment, will bedescribed.

In this embodiment, while a packing member 201 that is a carrier tape istransferred from one reel to another reel, each LED package 1 isindividually located into one recessed portion 202 of the packing member201. In this event, the LED package 1 is disposed upward, and a lowersurface of the LED package 1 faces a bottom surface 202 a of therecessed portion 202. Side surfaces of the LED package 1 face sidesurfaces 202 b to 202 e of the recessed portion 202. Next, a cover tape210 covers an upper end portion of the recessed portion 202 to seal theinside of the recessed portion 202. Then, the packing member 201 and thecover tape 210 are conveyed while wound onto the reel, for example.

Next, effects and advantages of this embodiment will be described.

In the packing member 201 according to this embodiment, the projectedportions 203 are formed at the side surfaces 202 b to 202 e of therecessed portion 202. This makes small the contact area between the sidesurfaces of the recessed portion 202 and the side surfaces of the LEDpackage 1 when the LED package 1 is located. For this reason, the sidesurfaces of the LED package 1 are less likely to adhere to the sidesurfaces of the recessed portion 202, and the LED package 1 is easilyhandled. Thereby, for example, at the delivery destination, theoperatability of unpacking the LED package 1 from the inside of therecessed portion 202 of the packing member 201 becomes favorable.Incidentally, since metallic lead frames are exposed from the lowersurface of the LED package 1, the lower surface of the LED package 1 isoriginally less likely to adhere to the packing member.

Next, the eighth embodiment will be described.

FIG. 24 is a plan view illustrating a packing member for the LED packageaccording to this embodiment.

As shown in FIG. 24, in a packing member 211 according to thisembodiment, projected portions 213 formed at side surfaces of therecessed portion 202 have rounded tips. The projected portions 213 aresemi-circular. This further reduces the contact area between the sidesurfaces of the recessed portion 202 and side surfaces of the LEDpackage 1. The packing member 211 and the LED package are surelyprevented from adhering to each other. Configuration, use method,effects and advantages, other than the above, of this embodiment are thesame as those of the above-described seventh embodiment.

Next, the ninth embodiment will be described.

FIG. 25 is a plan view illustrating a packing member for the LED packageaccording to this embodiment.

FIG. 26 is a cross-sectional view illustrating the packing member forthe LED package according to this embodiment.

As shown in FIGS. 25 and 26, in a packing member 204 according to thisembodiment, projected portions 215 are formed at side surfaces of therecessed portion 202. Each of the projected portions 215 has asemi-circular shape extending in a depth direction of the recessedportion 202. Such packing members 204 can be manufactured by a pressingmethod, and accordingly are manufactured easily. Configuration, usemethod, effects and advantages, other than the above, of this embodimentare the same as those of the above-described eighth embodiment.

Next, the tenth embodiment will be described.

FIG. 27 is a cross-sectional view illustrating a packing member for theLED package according to this embodiment.

As shown in FIG. 27, a packing member 221 according to this embodimentincludes a carrier tape 222 and a cover tape 223. The configuration ofthe carrier tape 222 is the same as the configuration of theabove-described packing member 201 according to the seventh embodiment.The cover tape 223 is formed of, for example, a resin material or paper,and is formed of the same material as the material of, for example, thecarrier tape 222. The cover tape 223 has such a belt-like shape as tocover the carrier tape 222. Moreover, projected portions 224 are formedat a lower surface, i.e., a surface facing the carrier tape 222, of thecover tape 223. The projected portions 224 are formed in regions of thecarrier tape 222 facing the recessed portion 202 when the cover tape 223is adhered to the carrier tape 222. Thus, unevenness is formed on thelower surface of the cover tape 223. The unevenness of the cover tape223 is greater than unevenness formed on an upper surface of the LEDpackage, i.e., an upper surface of a transparent resin body.

According to this embodiment, the unevenness is formed not only on theside surfaces of the recessed portion 202 of the carrier tape 222 butalso on the lower surface of the cover tape 223. Thus, the upper surfaceof the LED package is prevented from adhering to the lower surface ofthe cover tape 223. Configuration, use method, effects and advantages,other than the above, of this embodiment are the same as those of theabove-described seventh embodiment.

Note that, in the above-described seventh to tenth embodiments, exampleshave been shown that two projected portions are formed at each sidesurface of the recessed portion 202. However, the invention is notlimited thereto. The number of projected portions at each side surfacemay be 1, 3, or larger. Moreover, the projected portions do not alwayshave to be arranged in the direction parallel to the surface of thepacking member. The arrangement of the projected portions may be shiftedin a depth direction of the recessed portion 202. Furthermore, in theabove-described seventh to tenth embodiments, examples have been shownthat unevenness is formed by forming the projected portions at the sidesurfaces of the recessed portion. However, the invention is not limitedthereto. For example, the unevenness may be formed by forming dents inthe side surfaces, or such unevenness may be formed by curving the sidesurfaces. In this manner also, the contact area between the sidesurfaces of the recessed portion and the side surfaces of the LEDpackage is reduced, and the adhesion is prevented. Still furthermore, inthe above-described seventh to tenth embodiments, examples have beenshown that the unevenness is formed on all the side surfaces of therecessed portion 202. However, the invention is not limited thereto. Acertain level of the effect is obtained by forming the unevenness atleast on one side surface. Still furthermore, the shape of the packingmember for an LED package according to the invention is not limited to abelt-like shape, and may be, for example, a sheet-like shape in whichrecessed portions are arranged in a matrix pattern.

According to the above-described seventh to tenth embodiments, a packingmember for the LED package easy to handle is provided.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the invention.

The invention claimed is:
 1. A packing member housing an LED package,comprising: a carrier member, a recessed portion to locate the LEDpackage being formed in the carrier member, first unevenness beingformed on at least a portion of a side surface of the recessed portion;and a cover member for covering the recessed portion, second unevennessbeing formed on a lower surface of the cover member, the LED packagehaving: first and second lead frames apart from each other; an LED chipprovided above the first and second lead frames, the LED chip having oneterminal connected to the first lead frame and another terminalconnected to the second lead frame; and a resin body covering the firstand second lead frames and the LED chip, and having an upper surfacewith a surface roughness of 0.15 μm or higher, the second unevenness ofthe cover member being greater than the surface roughness of the uppersurface of the resin body.
 2. The member according to claim 1, wherein aprojected portion is formed at the side surface of the recessed portion.3. The member according to claim 2, wherein the projected portion has arounded tip.
 4. The member according to claim 1, wherein the carriermember has a belt-like shape, and a plurality of the recessed portionsare arranged in one row.
 5. The member according to claim 1, wherein therecessed portion is formed of one substantially rectangular bottomsurface when seen from above and four side surfaces, and two projectedportions are formed at each side surface of the recessed portion.
 6. Themember according to claim 1, wherein a first projected portion and asecond projected portion are respectively formed at a lower surface ofthe first lead frame and a lower surface of the second lead frame of theLED package, a lower surface of the first projected portion and a lowersurface of the second projected portion are exposed from a lower surfaceof the resin body, side surfaces of the first projected portion and sidesurfaces of the second projected portion are covered with the resinbody, the first lead frame and the second lead frame have a first edgeand a second edge respectively, the first edge and the second edge faceeach other, the first projected portion is formed in a region beingapart from the first edge, the second projected portion is formed in aregion being apart from the second edge, and a portion having the firstedge and a portion having the second edge are thin plate portionsthinner than the regions having the first projected portion and thesecond projected portion, each of the first lead frame and the secondlead frame includes: a base portion; and a plural of extending portionsextending from the base portion in different directions from oneanother, and having lower surfaces covered with the resin body and tipedge surfaces exposed as side surfaces of the resin body, and edgesurfaces of the base portion are covered with the resin body.
 7. Themember according to claim 6, wherein the resin body has a rectangularshape when seen from above, and tip edge surfaces of the extendingportions each exposed as a corresponding one of three different sidesurfaces of the resin body.
 8. The member according to claim 6, whereinthe LED package further has: a first wire connecting the one terminal tothe first lead frame; a second wire connecting the another terminal tothe second lead frame; and a third lead frame disposed between the firstlead frame and the second lead frame, the one terminal and the anotherterminal are provided on an upper surface of the LED chip, a portion ofa lower surface and a portion of an edge surface of the third lead frameboth are exposed from the resin body, and the LED chip is mounted on thethird lead frame.